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Title: Power inverters

Abstract

Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.

Inventors:
 [1];  [2];  [3]
  1. Redondo Beach, CA
  2. Chino Hills, CA
  3. Woodland Hills, CA
Publication Date:
Research Org.:
GM Global Technology Operations LLC (Detroit, MI)
Sponsoring Org.:
USDOE
OSTI Identifier:
1033117
Patent Number(s):
8,059,404
Application Number:
US patent applicaiton 12/248,197
Assignee:
GM Global Technology Operations LLC (Detroit, MI) NETL
DOE Contract Number:  
FC26-07NT43123
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
24 POWER TRANSMISSION AND DISTRIBUTION

Citation Formats

Miller, David H, Korich, Mark D, and Smith, Gregory S. Power inverters. United States: N. p., 2011. Web.
Miller, David H, Korich, Mark D, & Smith, Gregory S. Power inverters. United States.
Miller, David H, Korich, Mark D, and Smith, Gregory S. Tue . "Power inverters". United States. https://www.osti.gov/servlets/purl/1033117.
@article{osti_1033117,
title = {Power inverters},
author = {Miller, David H and Korich, Mark D and Smith, Gregory S},
abstractNote = {Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 15 00:00:00 EST 2011},
month = {Tue Nov 15 00:00:00 EST 2011}
}

Patent:

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