Future technology challenges for failure analysis
Conference
·
OSTI ID:100084
Failure analysis is a critical element in the integrated circuit manufacturing industry. This paper explores the challenges for IC failure analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced failure analysis techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New paradigms will be required for failure analysis to keep pace with future advancements in IC technology.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 100084
- Report Number(s):
- SAND--95-0624C; CONF-951156--1; ON: DE95016411
- Country of Publication:
- United States
- Language:
- English
Similar Records
Failure analysis: Status and future trends
The Sematech failure analysis roadmap
Semiconductor product analysis challenges based on the 1999 ITRS
Conference
·
Tue Jan 31 23:00:00 EST 1995
·
OSTI ID:10110723
The Sematech failure analysis roadmap
Conference
·
Sat Dec 30 23:00:00 EST 1995
·
OSTI ID:260492
Semiconductor product analysis challenges based on the 1999 ITRS
Conference
·
Tue May 30 00:00:00 EDT 2000
·
OSTI ID:756408