Compliant layer chucking surface
Abstract
A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.
- Inventors:
-
- Dublin, CA
- Pleasanton, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 921909
- Patent Number(s):
- 6835415
- Application Number:
- 10/338,266
- Assignee:
- EUV LLC (Santa Clara, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Compliant layer chucking surface. United States: N. p., 2004.
Web.
Blaedel, Kenneth L, Spence, Paul A, & Thompson, Samuel L. Compliant layer chucking surface. United States.
Blaedel, Kenneth L, Spence, Paul A, and Thompson, Samuel L. Tue .
"Compliant layer chucking surface". United States. https://www.osti.gov/servlets/purl/921909.
@article{osti_921909,
title = {Compliant layer chucking surface},
author = {Blaedel, Kenneth L and Spence, Paul A and Thompson, Samuel L},
abstractNote = {A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 28 00:00:00 EST 2004},
month = {Tue Dec 28 00:00:00 EST 2004}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.