Thermally stable diamond brazing
- Kingwood, TX
A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.
- Research Organization:
- Technology International Inc
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-97FT34368
- Assignee:
- Technology International Inc
- Patent Number(s):
- 7,487,849
- Application Number:
- 11/130,036
- OSTI ID:
- 988352
- Country of Publication:
- United States
- Language:
- English
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