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Title: Polymer films

Patent ·
OSTI ID:985542
 [1];  [2]
  1. Champaign, IL
  2. Maplewood, NJ
+ Show Author Affiliations

A film contains a first polymer having a plurality of hydrogen bond donating moieties, and a second polymer having a plurality of hydrogen bond accepting moieties. The second polymer is hydrogen bonded to the first polymer.

Research Organization:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-91ER45439
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL)
Patent Number(s):
7,470,449
Application Number:
10/852,090
OSTI ID:
985542
Country of Publication:
United States
Language:
English

References (10)

Investigation into an Alternating Multilayer Film of Poly(4-Vinylpyridine) and Poly(acrylic acid) Based on Hydrogen Bonding journal January 1999
Layered, Erasable Polymer Multilayers Formed by Hydrogen-Bonded Sequential Self-Assembly journal January 2002
Molecular-Level Processing of Conjugated Polymers. 4. Layer-by-Layer Manipulation of Polyaniline via Hydrogen-Bonding Interactions journal May 1997
A new approach for the fabrication of an alternating multilayer film of poly(4-vinylpyridine) and poly(acrylic acid) based on hydrogen bonding journal June 1997
New electro-active self-assembled multilayer thin films based on alternately adsorbed layers of polyelectrolytes and functional dye molecules journal March 1997
Controlling Bilayer Composition and Surface Wettability of Sequentially Adsorbed Multilayers of Weak Polyelectrolytes journal June 1998
Molecular-Level Processing of Conjugated Polymers. 3. Layer-by-Layer Manipulation of Polyaniline via Electrostatic Interactions journal May 1997
Polymeric Multilayer Films Comprising Deconstructible Hydrogen-Bonded Stacks Confined between Electrostatically Assembled Layers journal April 2003
Layered, Erasable, Ultrathin Polymer Films journal October 2000
Poly(phenylenevinylene) analogs with ring substituted polar side chains and their use in the formation of hydrogen bonding basedself-assembled multilayers journal January 1998

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36 MATERIALS SCIENCE