Programmable Multi-Chip Module
Patent
·
OSTI ID:880241
- Lenexa, KS
- Lee's Summit, MO
- Overland Park, KS
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.
- Research Organization:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- DOE Contract Number:
- AC04-01AL66850
- Assignee:
- Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
- Patent Number(s):
- US 6,818,984
- Application Number:
- 10/697442
- OSTI ID:
- 880241
- Country of Publication:
- United States
- Language:
- English
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