Metallic substrates for high temperature superconductors

Patent · Tue Jan 01 00:00:00 EST 2002

OSTI ID:874754

Truchan, Thomas G ^[1]; Miller, Dean J ^[2]; Goretta, Kenneth C ^[3]; Balachandran, Uthamalingam ^[4]; Foley, Robert ^[1]

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1. Chicago, IL
2. Darien, IL
3. Downers Grove, IL
4. Hinsdale, IL

A biaxially textured face-centered cubic metal article having grain boundaries with misorientation angles greater than about 8.degree. limited to less than about 1%. A laminate article is also disclosed having a metal substrate first rolled to at least about 95% thickness reduction followed by a first annealing at a temperature less than about 375.degree. C. Then a second rolling operation of not greater than about 6% thickness reduction is provided, followed by a second annealing at a temperature greater than about 400.degree. C. A method of forming the metal and laminate articles is also disclosed.

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL (United States)
• DOE Contract Number: W-31109-ENG-38
• Assignee: The University of Chicago (Chicago, IL)
• Patent Number(s): US 6455166
• OSTI ID: 874754
• Country of Publication: United States
• Language: English

Related Subjects

metallic
substrates
temperature
superconductors
biaxially
textured
face-centered
cubic
metal
article
grain
boundaries
misorientation
angles
8degree
limited
laminate
disclosed
substrate
rolled
95
thickness
reduction
followed
annealing
375degree
rolling
operation
provided
400degree
method
forming
articles
metal substrate
metallic substrate
metal article
face-centered cubic
/428/148/420/505/