Test probe for surface mounted leadless chip carrier

Patent · Tue May 23 00:00:00 EDT 1989

OSTI ID:866978

Meyer, Kerry L ^[1]; Topolewski, John ^[2]

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1. Raytown, MO
2. Lenexa, KS

A test probe for a surface mounted leadless chip carrier is disclosed. The probed includes specially designed connector pins which allow size reductions in the probe. A thermoplastic housing provides spring action to ensure good mechanical and electrical contact between the pins and the contact strips of a leadless chip carrier. Other features include flexible wires molded into the housing and two different types of pins alternately placed in the housing. These features allow fabrication of a smaller and simpler test probe.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO (United States)
• DOE Contract Number: AC04-76DP00613
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4833404
• Application Number: 07/103,865
• OSTI ID: 866978
• Country of Publication: United States
• Language: English

Related Subjects

probe
surface
mounted
leadless
chip
carrier
disclosed
probed
specially
designed
connector
pins
allow
size
reductions
thermoplastic
housing
provides
spring
action
ensure
mechanical
electrical
contact
strips
features
flexible
wires
molded
types
alternately
placed
fabrication
simpler
surface mounted
specially designed
electrical contact
chip carrier
leadless chip
housing provides
mounted leadless
surface mount
plastic housing
/324/439/