Apparatus for sectioning demountable semiconductor samples
- Scottsdale, AZ
- Sun City West, AZ
Apparatus for use during polishing and sectioning operations of a ribbon sample is described. The sample holder includes a cylinder having an axially extending sample cavity terminated in a first funnel-shaped opening and a second slot-like opening. A spring-loaded pressure plunger is located adjacent the second opening of the sample cavity for frictional engagement of the sample prior to introduction of a molding medium in the sample cavity. A heat softenable molding medium is inserted in the funnel-shaped opening, to surround the sample. After polishing, the heater is energized to allow draining of the molding medium from the sample cavity. During manual polishing, the second end of the sample holder is inserted in a support ring which provides mechanical support as well as alignment of the sample holder during polishing. A gauge block for measuring the protrusion of a sample beyond the second wall of the holder is also disclosed.
- Research Organization:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- DOE Contract Number:
- EG-77-C-01-4042
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Number(s):
- US 4463927
- OSTI ID:
- 865117
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
sectioning
demountable
semiconductor
samples
polishing
operations
ribbon
sample
described
holder
cylinder
axially
extending
cavity
terminated
funnel-shaped
slot-like
spring-loaded
pressure
plunger
located
adjacent
frictional
engagement
prior
introduction
molding
medium
heat
softenable
inserted
surround
heater
energized
allow
draining
manual
support
provides
mechanical
alignment
gauge
block
measuring
protrusion
wall
disclosed
sample holder
located adjacent
axially extending
semiconductor sample
mechanical support
provides mechanical
sample prior
semiconductor samples
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