skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Cure analysis of an adhesive primer. [BR-125, a modified nitrile epoxy]

Technical Report ·
DOI:https://doi.org/10.2172/7295230· OSTI ID:7295230

Selection of a cure cycle is generally based on the results of extensive physical properties tests. The advent of dielectric analysis provides the means of accurately predicting cure schedules without this extensive testing. Dielectric analysis is based on the reaction of the dipoles within a polymer to an alternating electric field. As the field alternates the dipoles attempt to swivel in step but are restricted because of their relatively fixed position within the polymeric structure. Capacitance is the measure of the dipole's ability to align and dissipation is the power lost in alignment. For a thermosetting polymer, dissipation versus time curves provide an insight into the curing mechanism and can be correlated to known physical and chemical changes. The dissipation versus temperature curves provide a fingerprint of the curing polymer and extent of cure. The material evaluated in this study was BR-125 adhesive primer, a modified nitrile epoxy supplied by the Bloomingdale Division of American Cyanamid. Our application involved a special use of the primer as an adhesive which necessitated an alternative cure schedule. Typical curves of dissipation as a function of either time or temperature are shown. As a result of these curves, a minimum cure temperature was determined as well as an optimum cure cycle. T-Peel specimens were used to show that the alternate cure cycle suggested by the Audrey data was equivalent to the manufacturer's recommended cure and that the prediction of minimum cure temperature was also valid.

Research Organization:
Bendix Corp., Kansas City, MO (United States)
DOE Contract Number:
EY-76-C-04-0613
OSTI ID:
7295230
Report Number(s):
BDX-613-1656(Rev.)
Country of Publication:
United States
Language:
English