Mechanisms of high temperature crack growth in metals and alloys

Technical Report · Sun Jan 01 00:00:00 EST 1989

DOI:https://doi.org/10.2172/7075359· OSTI ID:7075359

Nix, W D

The high-temperature creep crack growth behavior of pure Cu, Cu--Sn alloy, and predamaged Cu has been investigated. The purposes of this study have been to understand the mechanisms of creep crack growth; to prove theoretical predictions with experimental studies; and eventually to predict the time to failure of high-temperature structural materials. High-temperature crack growth experiments have been conducted under various loading conditions with a computer-based data acquisition and control system. A model to describe creep crack growth in pre-damaged Cu has been developed. It is based on cavity growth by coupled diffusional and creep processes under the damage-modified stress field. High-temperature crack growth experiments have been carried out under cyclic loading conditions. 99 refs., 59 figs., 2 tabs.

• Research Organization: Stanford Univ., CA (USA). Dept. of Materials Science and Engineering
• Sponsoring Organization: DOE/ER
• DOE Contract Number: FG03-84ER45169
• OSTI ID: 7075359
• Report Number(s): DOE/ER/45169-T1; ON: DE90014934
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
CRACK PROPAGATION
COPPER ALLOYS
TIN ALLOYS
CORRELATIONS
CRACKS
CREEP
DIFFUSION
FINITE ELEMENT METHOD
GRAIN BOUNDARIES
MATHEMATICAL MODELS
PROGRESS REPORT
TEMPERATURE EFFECTS
ALLOYS
CRYSTAL STRUCTURE
DOCUMENT TYPES
ELEMENTS
MECHANICAL PROPERTIES
METALS
MICROSTRUCTURE
NUMERICAL SOLUTION
TRANSITION ELEMENTS
360103* - Metals & Alloys- Mechanical Properties