High performance low cost interconnections for flip chip attachment with electrically conductive adhesive. Final report
This final report is a compilation of final reports from each of the groups participating in the program. The main three groups involved in this effort are the Thomas J. Watson Research Center of IBM Corporation in Yorktown Heights, New York, Assembly Process Design of IBM Corporation in Endicott, New York, and SMT Laboratory of Universal Instruments Corporation in Binghamton, New York. The group at the research center focused on the conductive adhesive materials development and characterization. The group in process development focused on processing of the Polymer-Metal-Solvent Paste (PMSP) to form conductive adhesive bumps, formation of the Polymer-Metal Composite (PMC) on semiconductor devices and study of the bonding process to circuitized organic carriers, and the long term durability and reliability of joints formed using the process. The group at Universal Instruments focused on development of an equipment set and bonding parameters for the equipment to produce bond assembly tooling. Reports of each of these individual groups are presented here reviewing their technical efforts and achievements.
- Research Organization:
- IBM Corp., Endicott, NY (United States)
- Sponsoring Organization:
- USDOE Assistant Secretary for Human Resources and Administration, Washington, DC (United States)
- DOE Contract Number:
- FC04-94AL98817
- OSTI ID:
- 656683
- Report Number(s):
- DOE/AL/98817-T1; ON: DE98005206; TRN: AHC29817%%239
- Resource Relation:
- Other Information: PBD: [1998]
- Country of Publication:
- United States
- Language:
- English
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