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Title: Resistive Contrast Imaging applied to multilevel interconnection failure analysis

Conference ·
OSTI ID:6251637

Resistive Contrast Imaging (RCI) is a new failure analysis technique that uses a scanning electron microscope to generate a relative resistance map of an integrated circuit. The RCI map may be used to localize abrupt changes in resistance and verify continuity. Results using RCI on several two-level interconnection devices are described. The images demonstrate how RCI may be used to differentiate between levels and to localize metal shorts and opens. Methods for improving image quality and level differentiation as well as future development work are discussed. 9 refs., 8 figs.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6251637
Report Number(s):
SAND-89-0486C; CONF-8906115-1; ON: DE89011066
Resource Relation:
Conference: VLSI multilevel interconnection conference, Santa Clara, CA, USA, 12 Jun 1989; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English