Computational continuum modeling of solder interconnects: Applications
The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Fb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a mini ball grid array solder interconnect. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the thermomechanical response of a mini ball grid array solder interconnects then will be presented.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 471390
- Report Number(s):
- SAND-97-0672C; CONF-970616-7; ON: DE97004032; TRN: 97:003080
- Resource Relation:
- Conference: ASME international intersociety electronic and photonic packaging conference and exhibition, Honolulu, HI (United States), 15-19 Jun 1997; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
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