Low-power multi-chip module and board-level links for data transfer
- Sandia National Labs., Albuquerque, NM (United States)
- Research Triangle Inst., Research Triangle Park, NC (United States)
Advanced device technologies such as Vertical Cavity Surface-Emitting Lasers (VCSELs) and diffractive micro lenses can be obtained with novel packaging techniques to allow low-power interconnection of parallel optical signals. These interconnections can be realized directly on circuit boards, in a multi-chip module format, or in packages that emulate electrical connectors. For applications such as stacking of Multi-Chip Module (MCM) layers, the links may be realized in bi-directional form using integrated diffractive microlenses. In the stacked MCM design, consumed electrical power is minimized by use of a relatively high laser output from high efficiency VCSELs, and a receiver design that is optimized for low power, at the expense of dynamic range. Within certain constraints, the design may be extended to other forms such as board-level interconnects.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 453514
- Report Number(s):
- SAND-97-0482C; CONF-970231-15; ON: DE97004375; TRN: AHC29707%%84
- Resource Relation:
- Conference: SPIE international symposium, San Jose, CA (United States), 8-14 Feb 1997; Other Information: PBD: [1997]
- Country of Publication:
- United States
- Language:
- English
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