Copper alloys for interconnectors and methods for making the same

Gianola, Daniel S.; Kim, Gyuseok

Title: Copper alloys for interconnectors and methods for making the same

Patent · Tue Oct 03 00:00:00 EDT 2023

OSTI ID:2293685

Gianola, Daniel S.; Kim, Gyuseok

Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.

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Research Organization:: Univ. of Pennsylvania, Philadelphia, PA (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: SC0008135

Assignee:: The Trustees of the University of Pennsylvania (Philadelphia, PA)

Patent Number(s):: 11,776,893

Application Number:: 16/624,045

OSTI ID:: 2293685

Resource Relation:: Patent File Date: 06/19/2018

Country of Publication:: United States

Language:: English

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