Encapsulation of thermal energy storage media
Patent
·
OSTI ID:2222190
In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.
- Research Organization:
- Univ. of South Florida, Tampa, FL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0003490
- Assignee:
- University of South Florida (Tampa, FL)
- Patent Number(s):
- 11,732,171
- Application Number:
- 16/709,408
- OSTI ID:
- 2222190
- Resource Relation:
- Patent File Date: 12/10/2019
- Country of Publication:
- United States
- Language:
- English
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