Monolithic integrated quantum dot photonic integrated circuits

Bowers, John E.; Gossard, Arthur; Jung, Daehwan; Norman, Justin; Shang, Chen; Wan, Yating

Title: Monolithic integrated quantum dot photonic integrated circuits

Patent · Tue Jul 04 00:00:00 EDT 2023

OSTI ID:2221947

Bowers, John E.; Gossard, Arthur; Jung, Daehwan; Norman, Justin; Shang, Chen; Wan, Yating

A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.

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Research Organization:: Univ. of California, Santa Barbara, CA (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E)

DOE Contract Number:: AR0000672

Assignee:: The Regents of the University of California (Oakland, CA)

Patent Number(s):: 11,693,178

Application Number:: 17/882,909

OSTI ID:: 2221947

Resource Relation:: Patent File Date: 08/08/2022

Country of Publication:: United States

Language:: English

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