Partial discharge suppression in high voltage solid-state devices

Patent · Tue Jan 17 00:00:00 EST 2023

OSTI ID:1987054

Sampayan, Stephen; Sampayan, Kristin Cortella

Devices, methods and techniques are disclosed to suppress electrical discharge and breakdown in insulating or encapsulation material(s) applied to solid-state devices. In one example aspect, a multi-layer encapsulation film includes a first layer of a first dielectric material and a second layer of a second dielectric material. An interface between the first layer and the second layer is configured to include molecular bonds to prevent charge carriers from crossing between the first layer and the second layer. The multi-layer encapsulation configuration is structured to allow an electrical contact and a substrate of the solid-state device to be at least partially surrounded by the multi-layer encapsulation configuration.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States); Opcondys, Inc., Manteca, CA (United States)
• Sponsoring Organization: USDOE Advanced Research Projects Agency - Energy (ARPA-E)
• DOE Contract Number: AC52-07NA27344; AR0000907
• Assignee: Lawrence Livermore National Security, LLC (Livermore, CA); Opcondys, Inc. (Manteca, CA)
• Patent Number(s): 11,557,646
• Application Number: 17/177,884
• OSTI ID: 1987054
• Resource Relation: Patent File Date: 02/17/2021
• Country of Publication: United States
• Language: English