Variable pin fin construction to facilitate compliant cold plates

Schultz, Mark Delorman

Title: Variable pin fin construction to facilitate compliant cold plates

Patent · Tue Nov 29 00:00:00 EST 2022

OSTI ID:1986870

Schultz, Mark Delorman

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

View Patent

Cite

Export

Save

Research Organization:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: B604142

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Number(s):: 11,515,230

Application Number:: 16/676,515

OSTI ID:: 1986870

Resource Relation:: Patent File Date: 11/07/2019

Country of Publication:: United States

Language:: English

References (24)

Heat Sink and Integrated Circuit Assembly Using the Same Lou, Choon Leong https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110156244 US Patent Application 12/651006; 20110156244	patent-application	June 2011
Area Array Packages with Overmolded Pin-Fin Heat Sinks Divakar, Mysore P.; Templeton, Jr., Thomas H. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20050161806 US Patent Application 10/763795; 20050161806	patent-application	July 2005
Integrated circuit package system with a heat sink Lee, Sangkwon; Lee, Tae Keun https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8030755 US Patent Document 8,030,755	patent	October 2011
Compliant thermal interface structure with vapor chamber Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7264041 US Patent Document 7,264,041	patent	September 2007
Compliant thermal interface structure utilizing spring elements Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7355855 US Patent Document 7,355,855	patent	April 2008
High performance cold plate for electronic cooling Ognibene, Edward J.; Holmansky, Evgeny N.; Johnson, Douglas L. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6634421 US Patent Document 6,634,421	patent	October 2003
Heat exchanger Symonds, Keith Thomas https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6968892 US Patent Document 6,968,892	patent	November 2005
End fed liquid heat exchanger for an electronic component Nelson, Richard D.; Gupta, Omkarnath R. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4884630 US Patent Document 4,884,630	patent	December 1989
Laminated Heat Exchanger Scott, David Russell https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20120168112 US Patent Application 12/985064; 20120168112	patent-application	July 2012
Liquid-Cooling Apparatus with Integrated Coolant Filter Campbell, Levi A.; Chu, Richard C.; David, Milnes P. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20150359139 US Patent Application 14/826433; 20150359139	patent-application	December 2015
Cooling structure using rigid movable elements Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7545648 US Patent Document 7,545,648	patent	June 2009
Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices Bharathan, Desikan; Bennion, Kevin; Kelly, Kenneth https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9010405 US Patent Document 9,010,405	patent	April 2015
Compliant thermal interface structure utilizing spring elements Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7545647 US Patent Document 7,545,647	patent	June 2009
Enhanced heat transfer structure with heat transfer members of variable density Dessiatoun, Serguei V.; Ivakhnenko, Igor https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6898082 US Patent Document 6,898,082	patent	May 2005
Integrated circuit stack Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8659898 US Patent Document 8,659,898	patent	February 2014
Integrated circuit stack Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8363402 US Patent Document 8,363,402	patent	January 2013
Heat Exchanger Bertolotti, Fabio P.; Sabatino, Daniel R. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100170667 US Patent Application 12/348582; 20100170667	patent-application	July 2010
Heat Sink Kwak, Young Hoon; Oh, Kyu Hwan https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130112388 US Patent Application 13/448797; 20130112388	patent-application	May 2013
Enhanced Heat Transfer Structure with Heat Transfer Members of Variable Density Dessiatoun, Serguei V.; Ivakhnenko, Igor https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20030227732 US Patent Application 10/434071; 20030227732	patent-application	December 2003
Flow Balancing Scheme for Two-Phase Refrigerant Cooled Rack Correa, Adrian https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20120097370 US Patent Application 13/279045; 20120097370	patent-application	April 2012
Heat Transfer Surfaces with Flanged Apertures Sperandei, Bryan; Evans, Bruce; So, Allan K. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080047696 US Patent Application 11/467642; 20080047696	patent-application	February 2008
Compliant Pin Fin Heat Sink and Methods Karidis, John P.; Schultz, Mark D. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130199767 US Patent Application 13/364907; 20130199767	patent-application	August 2013
Liquid-Cooling Apparatus with Integrated Coolant Filter Campbell, Levi A.; Chu, Richard C.; David, Milnes P. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20150173251 US Patent Application 14/132230; 20150173251	patent-application	June 2015
Heat Sink Tong, Wei; Boyland, John https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080066888 US Patent Application 11/530237; 20080066888	patent-application	March 2008

Similar Records

Variable pin fin construction to facilitate compliant cold plates

Patent · Tue Dec 10 00:00:00 EST 2019 · OSTI ID:1986870

Schultz, Mark Delorman

Pin fin compliant heat sink with enhanced flexibility

Patent · Tue Apr 10 00:00:00 EDT 2018 · OSTI ID:1986870

Schultz, Mark D.

Pattern bonded finned cold plate

Patent · Tue Mar 22 00:00:00 EDT 2022 · OSTI ID:1986870

Schultz, Mark D.

Title: Variable pin fin construction to facilitate compliant cold plates

Citation Formats

References (24)

Similar Records

Related Subjects