Monolithic integrated quantum dot photonic integrated circuits
Patent
·
OSTI ID:1925067
A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
- Research Organization:
- Univ. of California, Oakland, CA (United States)
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- DOE Contract Number:
- AR0000672
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 11,435,524
- Application Number:
- 17/058,057
- OSTI ID:
- 1925067
- Resource Relation:
- Patent File Date: 05/24/2019
- Country of Publication:
- United States
- Language:
- English
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