Si-based CTE-matched substrate for laser diode packaging

Patent · Tue Aug 09 00:00:00 EDT 2022

OSTI ID:1924978

Patra, Susant; Deri, Robert J.; Elmer, John W.

A Cu—Si—Cu substrate having a silicon substrate, copper plating on opposite sides of the silicon substrate, and copper vias extending thru the silicon substrate to electrically and thermally connect the copper platings together. The thicknesses of the silicon substrate and the copper platings are selected so that a coefficient of thermal expansion (CTE) of the Cu—Si—Cu substrate is substantially the same as a CTE of a material to be mounted on the Cu—Si—Cu substrate.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC52-07NA27344
• Assignee: Lawrence Livermore National Security, LLC (Livermore, CA)
• Patent Number(s): 11,411,370
• Application Number: 15/080,514
• OSTI ID: 1924978
• Resource Relation: Patent File Date: 03/24/2016
• Country of Publication: United States
• Language: English