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Title: Novel and effective surface passivation for high efficiency n- and p-type Silicon solar cell

Technical Report ·
DOI:https://doi.org/10.2172/1859832· OSTI ID:1859832
ORCiD logo [1];  [2];  [3];  [2];  [1];  [3];  [1];  [2];  [3];  [4];  [3]
  1. Univ. of Delaware, Newark, DE (United States)
  2. Georgia Institute of Technology, Atlanta, GA (United States)
  3. Univ. of Nevada, Las Vegas, NV (United States)
  4. Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

The project objective was to develop a novel Si surface passivation method using chalcogens, sulfur (S) and/or selenium (Se), as passivating elements, to withstand industry-standard high temperature contacting and metallization schemes for p-type Si based passivated emitter and rear contact (p-PERC) solar cells. The back surface passivation of PERC cells has been improved drastically with the invention and successful application of an Al2O3 passivation layer. However, the front n+ diffused junction surface is still poorly passivated by the standard amorphous silicon nitride (SiNx) anti-reflection coating (ARC) layer. This project sought to address the passivation challenges of both front n+ emitter and undiffused p-Si back surface. Improved p-PERC solar cell performance with open circuit voltage (VOC) > 680 mV and efficiency of 22% were targeted to validate superior defect passivation properties as compared to standard SiO2 / Al2O3 passivation. During this project, we systematically investigated process-structure-properties-performance relationships of this novel advanced defect passivation approach. The S/Se passivation was carried out by reacting industrial Czochralski (Cz) Si wafers in H2S and H2Se gases in a chemical vapor deposition (CVD) reactor at temperatures up to 700°C. After an exhaustive optimization of the process parameters (temperature, time, and gas concentration), we established an optimized process and demonstrated extremely low surface recombination velocities (SRVs) of 1.5 cm/s and 8 cm/s on n-type and p-type Si, respectively, by S-passivation. In-depth surface and interface characterization were performed using soft x-ray and photoelectron spectroscopies (XPS, UPS, XES), combined with capacitance-voltage-frequency (C-V-f) measurements, to decipher the surface chemical/electronic structure and interface defect state densities. These measurements provided critical understanding of the defect passivation mechanism and elucidated the presence of surface S-Si bonds, a reduction of surface dipoles, and low interface state densities (Dit) < 1011 cm-2 ev-1. We also found that the Se-passivation is inferior to the S-passivation (by at least one order of magnitude in SRV). Application of the optimized S-passivation to the n+ diffused emitter surface led to a low surface recombination current density, J0 ≈ 40 fA/cm2 (~ 1/4 of the industry-standard SiNx-passivation), and high implied VOC (686 mV) in p-PERC solar cell structures. The S-passivation process also was found to improve the bulk quality of the p-type Si, better than the SiO2 or Al2O3 passivation processes. After successful demonstration of efficient passivation of Si surface defects by S, we extensively studied the air, thermal, and illumination stability of the passivation structure. S-passivation itself degrades in air due to competing reactions with moisture and oxygen to form oxides, which can be eliminated by a SiNx capping layer (also acting as a anti-reflective coating). After SiNx process optimization, we demonstrated illumination and thermally stable S-passivation with SRV < 5 cm/s and J0 < 80 fA/cm2. These enhancements in Si passivation, incorporated into p-PERC cells, achieved an efficiency of 19.93% with VOC = 649 mV, using manufacturing metallization and contacting schemes. The low cell performance (cell VOC is much less than the implied VOC = 686 mV, anticipated from surface passivation) was identified due to degradation of S-passivation during the metal firing step (out-diffusion of S from the Si interface to the SiNx surface). The S-passivation of Si surfaces shows significant promise with excellent passivation quality, essential for high performance (high VOC, high efficiency) solar cells. Integration of this innovative defect passivation into devices, however, demands further development of the capping layer, low temperature (<700°C) metallization process, and/or engineering of advanced device structures. Surface passivation-dominated advanced Si solar cells, such as tunnel oxide passivated contacts and Si heterojunctions, are increasingly of interest due to their high-performance potential and will have a growing photovoltaic market share in the near future.

Research Organization:
Univ. of Delaware, Newark, DE (United States); Georgia Institute of Technology, Atlanta, GA (United States); Univ. of Nevada, Las Vegas, NV (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office
DOE Contract Number:
EE0008554; FOA-0001840
OSTI ID:
1859832
Report Number(s):
DOE-UDEL-8554
Country of Publication:
United States
Language:
English