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Title: Incorporation of GTR (generation–transport–recombination) in semiconductor simulations

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/5.0037411· OSTI ID:1850892
ORCiD logo [1]; ORCiD logo [2];  [3]; ORCiD logo [3]
  1. Univ. of Connecticut, Storrs, CT (United States). Dept. of Electrical and Computer Engineering; United International Univ., Dhaka (Bangladesh). Dept. of Electrical and Electronic Engineering
  2. Univ. of Manchester (United Kingdom). National Graphene Inst.
  3. Univ. of Connecticut, Storrs, CT (United States). Dept. of Electrical and Computer Engineering

With the emergence of phase change memory, where the devices experience extreme thermal gradients (~100 K/nm) during transitions between low and high resistive states, the study of thermoelectric effects at small scales becomes particularly relevant. We had earlier observed asymmetric melting of self-heated nano-crystalline silicon micro-wires, where current densities of ~107 A/cm2 were forced through the wires by 1 μs, ~30 V pulses. The extreme asymmetry can be explained by the generation of considerable amount of minority carriers, transport under the electric field, and recombination downstream, a heat transfer process we termed as generation–transport–recombination, which is in opposite direction of the electronic-convective heat carried by the majority carriers. Here, we present a full semiconductor physics treatment of this carrier-lattice heat transport mechanism and the contribution of the minority carriers on the evolution of the melt–solid interface, which can be applied to various high-temperature electronic devices.

Research Organization:
Univ. of Connecticut, Storrs, CT (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
SC0005038
OSTI ID:
1850892
Alternate ID(s):
OSTI ID: 1970560
Journal Information:
Journal of Applied Physics, Vol. 129, Issue 5; ISSN 0021-8979
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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