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Title: Flow boiling of R134a in a large surface area microchannel array for high-flux laser diode cooling

Journal Article · · Heat Transfer Research
 [1];  [1];  [1];  [2];  [2];  [1]
  1. Colorado State Univ., Fort Collins, CO (United States)
  2. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Packaging high average power laser diode arrays that generate heat at an area average flux in excess of 1 kW·cm-2 is a significant engineering challenge. While liquid microchannel coolers have demonstrated up to 11.9 kW·cm-2, two-phase microchannel array coolers have not achieved 1 kW cm-2 due to critical heat flux and flow instabilities. In the current study, flow boiling heat transfer was characterized by a 1 × 10 mm heated zone centered over a 5 × 10 mm array of 125 very small channels (45 × 200 μm) with R134a as the phase change fluid. The high aspect ratio channels (4.4:1) were manufactured using MEMS fabrication techniques, which yielded a large heat transfer surface area to volume ratio. A test facility was used to characterize the heat transfer performance of boiling R134a over a range of saturation temperatures (15°C to 25°C), mass fluxes (735-2230 kg·m-2·s-1), and heat duties (< 110.3 W). During the tests, the calculated outlet vapor quality exceeded 61%, and the base heat flux at the heater reached a maximum of 1.1 kW·cm-2. The resulting average experimental flow boiling heat transfer coefficients are found to be as large a 13.4 kW·m-2·K-1 over the approximately 3 mm two-phase region, with an average uncertainty of ± 2.72%. A substantial amount of heat was spread downstream via the low thermal resistance silicon floor. Specifically, between 29.5% and 55.1% of the heat dissipated in the two-phase region was dissipated over the heater. Finally, the remaining heat dissipated in the two-phase region was dissipated in the 2 mm of channel downstream of the heater. This suggests that heat spreading from the hotspot played a vital role in dissipating the heat load.

Research Organization:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC52-07NA27344
OSTI ID:
1838601
Report Number(s):
LLNL-JRNL-760960; 949798
Journal Information:
Heat Transfer Research, Vol. 50, Issue 14; ISSN 1064-2285
Publisher:
Begell HouseCopyright Statement
Country of Publication:
United States
Language:
English

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