Thermoelastic cooling

Takeuchi, Ichiro; Cui, Jun; Wuttig, Manfred R.; Wu, Yiming; Radermacher, K. Reinhard; Hwang, Yunho; Muehlbauer, Jan

Title: Thermoelastic cooling

Patent · Tue Oct 20 00:00:00 EDT 2020

OSTI ID:1771528

Takeuchi, Ichiro; Cui, Jun; Wuttig, Manfred R.; Wu, Yiming; Radermacher, K. Reinhard; Hwang, Yunho; Muehlbauer, Jan

A cooling system based on thermoelastic effect is provided. The system comprises a heat sink, a refrigerated space and a regenerator coupled to the refrigerated space and to the heat sink to pump heat from the refrigerated space to the heat sink. The regenerator comprises solid thermoelastic refrigerant materials capable of absorbing or releasing heat.

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Research Organization:: Univ. of Maryland, College Park, MD (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E)

DOE Contract Number:: AR0000131

Assignee:: University of Maryland, College Park (College Park, MD)

Patent Number(s):: 10,808,159

Application Number:: 16/180,649

OSTI ID:: 1771528

Resource Relation:: Patent File Date: 11/05/2018

Country of Publication:: United States

Language:: English

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