Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO2/Al2O3/HfO2 Triple-Interlayer for Biomedical Implants

Li, Changzheng; Cauwe, Maarten; Yang, Yang; Schaubroeck, David; Mader, Lothar; Op De Beeck, Maaike

doi:10.3390/coatings9090579

Title: Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO₂/Al₂O₃/HfO₂ Triple-Interlayer for Biomedical Implants

Journal Article · Thu Sep 12 00:00:00 EDT 2019 · Coatings

DOI:https://doi.org/10.3390/coatings9090579· OSTI ID:1770811

Li, Changzheng ^[1]; Cauwe, Maarten ^[1];

^[2]; Schaubroeck, David ^[1]; Mader, Lothar ^[1]; Op De Beeck, Maaike ^[1]

Ghent Univ. (Belgium)
Ghent Univ. (Belgium); Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

Long-term packaging of miniaturized, flexible implantable medical devices is essential for the next generation of medical devices. Polymer materials that are biocompatible and flexible have attracted extensive interest for the packaging of implantable medical devices, however realizing these devices with long-term hermeticity up to several years remains a great challenge. Here, polyimide (PI) based hermetic encapsulation was greatly improved by atomic layer deposition (ALD) of a nanoscale-thin, biocompatible sandwich stack of HfO₂/Al₂O₃/HfO₂ (ALD-3) between two polyimide layers. A thin copper film covered with a PI/ALD-3/PI barrier maintained excellent electrochemical performance over 1028 days (2.8 years) during acceleration tests at 60 °C in phosphate buffered saline solution (PBS). This stability is equivalent to approximately 14 years at 37 °C. The coatings were monitored in situ through electrochemical impedance spectroscopy (EIS), were inspected by microscope, and were further analyzed using equivalent circuit modeling. The failure mode of ALD Al₂O₃, ALD-3, and PI soaking in PBS is discussed. Encapsulation using ultrathin ALD-3 combined with PI for the packaging of implantable medical devices is robust at the acceleration temperature condition for more than 2.8 years, showing that it has great potential as reliable packaging for long-term implantable devices.

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Research Organization:: Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

Sponsoring Organization:: USDOE; Chinese Scholarship Council

Grant/Contract Number:: AC05-76RL01830; 201406150084

OSTI ID:: 1770811

Report Number(s):: PNNL-SA-147010

Journal Information:: Coatings, Vol. 9, Issue 9; ISSN 2079-6412

Publisher:: MDPICopyright Statement

Country of Publication:: United States

Language:: English

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Accelerated Hermeticity Testing of Biocompatible Moisture Barriers Used for the Encapsulation of Implantable Medical Devices Li, Changzheng; Cauwe, Maarten; Mader, Lothar Coatings, Vol. 10, Issue 1 https://doi.org/10.3390/coatings10010019	journal	December 2019

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60 APPLIED LIFE SCIENCES
Al2O3
HfO2
polyimide
EIS
moisture barriers
lifetime
implantable medical devices

Title: Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO2/Al2O3/HfO2 Triple-Interlayer for Biomedical Implants

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References (38)

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Title: Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO₂/Al₂O₃/HfO₂ Triple-Interlayer for Biomedical Implants