skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Predicting strength distributions of MEMS structures using flaw size and spatial density

Journal Article · · Microsystems & Nanoengineering (Online)
ORCiD logo [1]; ORCiD logo [2];  [3]
  1. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Material Measurement Laboratory
  2. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States). Materials Measurement Science Division, Applied Chemicals and Materials Division
  3. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Materials Science and Engineering Center

The populations of flaws in individual layers of microelectromechanical systems (MEMS) structures are determined and verified using a combination of specialized specimen geometry, recent probabilistic analysis, and topographic mapping. Strength distributions of notched and tensile bar specimens are analyzed assuming a single flaw population set by fabrication and common to both specimen geometries. Both the average spatial density of flaws and the flaw size distribution are determined and used to generate quantitative visualizations of specimens. Scanning probe-based topographic measurements are used to verify the flaw spacings determined from strength tests and support the idea that grain boundary grooves on sidewalls control MEMS failure. The findings here suggest that strength controlling features in MEMS devices increase in separation, i.e., become less spatially dense, and decrease in size, i.e., become less potent flaws, as processing proceeds up through the layer stack. The method demonstrated for flaw population determination is directly applicable to strength prediction for MEMS reliability and design.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
NA0003525
OSTI ID:
1624021
Alternate ID(s):
OSTI ID: 1870472
Report Number(s):
SAND2022-3867J; PII: 93
Journal Information:
Microsystems & Nanoengineering (Online), Vol. 5, Issue 1; ISSN 2055-7434
Publisher:
Springer NatureCopyright Statement
Country of Publication:
United States
Language:
English

References (32)

An argument for proof testing brittle microsystems in high-reliability applications journal October 2008
Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS journal December 2006
A Methodology for Accurately Measuring Mechanical Properties on the Micro-Scale: Measuring Mechanical Properties on the Micro-Scale journal May 2011
Fracture toughness of polysilicon MEMS devices journal May 2000
Crystal orientation-dependent fatigue characteristics in micrometer-sized single-crystal silicon journal July 2016
Strength of polysilicon for MEMS devices conference August 1999
Size and Frequency of Defects in Silicon MEMS journal October 2003
Mechanical Characterization of Polysilicon Through On-Chip Tensile Tests journal April 2004
Controlling and Testing the Fracture Strength of Silicon on the Mesoscale journal June 2000
Strength Distributions in Polycrystalline Silicon MEMS journal April 2007
A Sequential Tensile Method for Rapid Characterization of Extreme-value Behavior in Microfabricated Materials journal September 2009
Predicting Fracture in Micrometer-Scale Polycrystalline Silicon MEMS Structures journal August 2011
Strength distribution of single-crystal silicon theta-like specimens journal August 2010
Etching Process Effects on Surface Structure, Fracture Strength, and Reliability of Single-Crystal Silicon Theta-Like Specimens journal June 2013
Validated Prediction of the Strength Size Effect in Polycrystalline Silicon Using the Three-Parameter Weibull Function journal September 2014
On-chip fracture testing of freestanding nanoscale materials journal December 2015
Fracture strength of micro- and nano-scale silicon components journal June 2015
Material Flaw Populations and Component Strength Distributions in the Context of the Weibull Function journal August 2018
Determination of ceramic flaw populations from component strengths journal February 2019
Fracture of Brittle Solids book January 2010
Stronger silicon for microsystems journal January 2010
Statistical determination of surface flaw distributions in brittle materials journal January 1995
Size Effects and Stochastic Behavior of Nanoindentation Pop In journal April 2011
Scale effects in convoluted thermal/spatial statistics of plasticity initiation in small stressed volumes during nanoindentation journal October 2012
Strength statistics of single crystals and metallic glasses under small stressed volumes journal September 2016
Dislocation slip transmission through a coherent Σ3{111} copper twin boundary: Strain rate sensitivity, activation volume and strength distribution function journal December 2018
Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures journal April 1999
A first passage based model for probabilistic fracture of polycrystalline silicon MEMS structures journal February 2017
Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM journal December 2000
Size and Frequency of Defects in Silicon MEMS conference June 2008
Dislocation slip transmission through a coherent Σ3{111} copper twin boundary: strain rate sensitivity, activation volume and strength distribution function collection January 2018
The mechanical strength of polysilicon films: Part 1. The influence of fabrication governed surface conditions journal August 2003

Cited By (1)

Effects of nano‐grain structures and surface defects on fracture of micro‐scaled polysilicon components journal February 2020

Figures / Tables (8)


Similar Records

Shoulder fillet effects in strength distributions of microelectromechanical system components
Journal Article · Fri Nov 06 00:00:00 EST 2020 · Journal of Micromechanics and Microengineering. Structures, Devices and Systems · OSTI ID:1624021

Predicting fracture in micron-scale polycrystalline silicon MEMS structures.
Technical Report · Wed Sep 01 00:00:00 EDT 2010 · OSTI ID:1624021

Fatigue failure in thin-film polysilicon is due to subcriticalcracking within the oxide layer
Journal Article · Tue Jan 11 00:00:00 EST 2005 · Applied Physics Letters · OSTI ID:1624021