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Title: Nanomaterial assisted bonding method to produce curved surfaces

Patent ·
OSTI ID:1600318

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-06CH11357
Assignee:
U.S. Department of Energy (Washington, DC)
Patent Number(s):
10,486,405
Application Number:
15/872,011
OSTI ID:
1600318
Resource Relation:
Patent File Date: 01/16/2018
Country of Publication:
United States
Language:
English

References (2)

Composite Body Made of Ceramic Layers and Method for the Production Thereof patent-application August 2005
Assembly for Fabricating Large Dimension Bonds Using Reactive Multilayer Joining patent-application June 2008

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