Structural hierarchy of nanocarbon in copper covetics

Ma, Beihai; Balachandran, Uthamalingam; Wang, Jie; Wen, Jianguo; Lee, Tae H.; Dorris, Stephen E.; Rondinone, Adam J.

doi:10.1063/1.5052622

Title: Structural hierarchy of nanocarbon in copper covetics

Journal Article · Mon Oct 22 00:00:00 EDT 2018 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.5052622· OSTI ID:1479286

^[1]; Balachandran, Uthamalingam ^[1]; Wang, Jie ^[1]; Wen, Jianguo ^[1]; Lee, Tae H. ^[1]; Dorris, Stephen E. ^[1]; Rondinone, Adam J. ^[2]

Argonne National Lab. (ANL), Argonne, IL (United States)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Here, we prepared 0.4 wt.% carbon infused copper (i.e., copper covetic, CuCv) by electronbeam melting and deposited ≈18 nm-thick films of the CuCv on a substrate by electron-beam evaporation. Helium ion microscopy (HIM) and scanning transmission electron microscopy (STEM) were used to study the characteristics of the carbon nanostructure in the CuCv bulk and thin films. HIM observation of the fracture and ion-polished surface of bulk CuCv revealed ripple structures that are associated with carbon nanoribbons formed in the copper matrix. STEM high angle annular dark field (HAADF) imaging and energy dispersive X-ray spectroscopy (EDX) mapping indicated that carbon nanoparticles and carbon-rich pathways are interconnected to form a carbon-rich network in the CuCv films. High-resolution transmission electron microscopy and STEM electron energy loss spectroscopy (EELS) suggest that the carbon nanoparticles are composed of highly distorted graphenic carbon sheets, bond to copper matrix, and likely provide means for superior electrical and thermal conduction. In this letter, we report structural hierarchy and representations of carbon nanostructure in copper covetics at different scales.

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Research Organization:: Argonne National Lab. (ANL), Argonne, IL (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Advanced Manufacturing Office

Grant/Contract Number:: AC02-06CH11357

OSTI ID:: 1479286

Alternate ID(s):: OSTI ID: 1478548

Journal Information:: Applied Physics Letters, Vol. 113, Issue 17; ISSN 0003-6951

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 1 work

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Preparation and electrical conductivity of graphitic carbon-infused copper alloys Ma, B.; Balachandran, U.; Dorris, S. E. MRS Communications, Vol. 9, Issue 01 https://doi.org/10.1557/mrc.2019.12	journal	January 2019

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Related Subjects

36 MATERIALS SCIENCE
copper covetics
carbon nanostructure
electron-beam evaporation
helium ion microscopy (HIM)
scanning transmission electron microscopy (STEM)