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Title: Demonstration of 22-nm half pitch resolution on the SHARP EUV microscope

Journal Article · · Journal of Vacuum Science and Technology B
DOI:https://doi.org/10.1116/1.4929509· OSTI ID:1435057
 [1];  [1];  [1];  [1];  [1];  [1];  [2]
  1. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
  2. Inpria Corporation, Corvallis, OR (United States)

The Semiconductor High-Numerical-aperture (NA) Actinic Reticle Review Project (SHARP) is an extreme ultraviolet (EUV)-wavelength, synchrotron-based microscope dedicated to advanced EUV photomask research. The instrument is designed to emulate current and future generations of EUV lithography (EUVL). The performance of the SHARP microscope has been well characterized for its low-NA lenses, emulating imaging in 0.25 and 0.33NA lithography scanners. Evaluating the resolution of its higher-NA lenses, intended to emulate future generations of EUV lithography, requires a photomask with features down to 22-nm half pitch. The authors fabricated a sample with features down to 20-nm half pitch, exposing a wafer with a standard multilayer coating in the Berkeley microfield exposure tool, and used it to demonstrate real-space imaging down to 22-nm half pitch on the SHARP microscope. In conclusion, the demonstrated performance of SHARP's high-NA zoneplates, together with the extended capabilities of the tool, provide a platform that is available today, suited for research targeted at upcoming generations of EUVL many years into the future.

Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC02-05CH11231
OSTI ID:
1435057
Alternate ID(s):
OSTI ID: 1421218
Journal Information:
Journal of Vacuum Science and Technology B, Vol. 33, Issue 6; ISSN 2166-2746
Publisher:
American Vacuum Society/AIPCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 12 works
Citation information provided by
Web of Science

References (19)

Development and characterization of advanced phase-shift mask blanks for 14nm node and beyond conference September 2014
Capability of etched multilayer EUV mask fabrication conference September 2014
Production of EUV mask blanks with low killer defects conference April 2014
Learning from native defects on EUV mask blanks conference July 2014
Enhancing defect detection with Zernike phase contrast in EUV multilayer blank inspection conference March 2015
Repairing native defects on EUV mask blanks conference October 2014
Understanding EUV mask blank surface roughness induced LWR and associated roughness requirement conference March 2015
Experimental measurements of telecentricity errors in high-numerical-aperture extreme ultraviolet mask images
  • Raghunathan, Sudharshanan; Wood, Obert R.; Mangat, Pawitter
  • Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 32, Issue 6 https://doi.org/10.1116/1.4901876
journal November 2014
Imaging impact of multilayer tuning in EUV masks, experimental validation conference October 2014
Actinic mask imaging: recent results and future directions from the SHARP EUV microscope conference April 2014
Fourier-synthesis custom-coherence illuminator for extreme ultraviolet microfield lithography journal January 2003
ASML's NXE platform performance and volume introduction conference April 2013
EUV lithography: NXE platform performance overview conference April 2014
New ways of looking at masks with the SHARP EUV microscope conference March 2015
Actinic review of EUV masks: Status and recent results of the AIMS EUV system conference March 2015
EUV source-mask optimization for 7nm node and beyond conference April 2014
EUV lithography optics for sub-9nm resolution conference March 2015
Integrated fab process for metal oxide EUV photoresist conference March 2015
The SEMATECH Berkeley MET pushing EUV development beyond 22nm half pitch conference March 2010

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