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Title: Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles

Journal Article · · Materials Today Physics
 [1];  [2]; ORCiD logo [3];  [4];  [2];  [1]
  1. Boston College, Chestnut Hill, MA (United States)
  2. LITEN, Grenoble cedex (France)
  3. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  4. TU Wien, Vienna (Austria)

Here, silicon carbide (SiC) is a wide band gap semiconductor with a variety of industrial applications. Among its many useful properties is its high thermal conductivity, which makes it advantageous for thermal management applications. In this paper we present ab initio calculations of the in-plane and cross-plane thermal conductivities, κin and κout, of three common hexagonal polytypes of SiC: 2H, 4H and 6H. The phonon Boltzmann transport equation is solved iteratively using as input interatomic force constants determined from density functional theory. Both κin and κout decrease with increasing n in nH SiC because of additional low-lying optic phonon branches. These optic branches are characterized by low phonon group velocities, and they increase the phase space for phonon-phonon scattering of acoustic modes. Also, for all n, κin is found to be larger than κout in the temperature range considered. At electron concentrations present in experimental samples, scattering of phonons by electrons is shown to be negligible except well below room temperature where it can lead to a significant reduction of the lattice thermal conductivity. This work highlights the power of ab initio approaches in giving quantitative, predictive descriptions of thermal transport in materials. It helps explain the qualitative disagreement that exists among different sets of measured thermal conductivity data and provides information of the relative quality of samples from which measured data was obtained.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1376463
Alternate ID(s):
OSTI ID: 1550279
Journal Information:
Materials Today Physics, Vol. 1, Issue C; ISSN 2542-5293
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 38 works
Citation information provided by
Web of Science

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Cited By (6)

Thermal conductivity of GaN, GaN 71 , and SiC from 150 K to 850 K journal January 2019
Thermal boundary resistance measurement and analysis across SiC/SiO 2 interface journal September 2019
Molecular dynamics simulations of silicon carbide nanowires under single-ion irradiation journal September 2019
Strong effect of electron-phonon interaction on the lattice thermal conductivity in 3C-SiC journal August 2017
Modeling ballistic phonon transport from a cylindrical electron beam heat source journal September 2019
Thermal Boundary Resistance Measurement and Analysis Across SiC/SiO2 Interface text January 2019