Ceramic substrate including thin film multilayer surface conductor
A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC
- Patent Number(s):
- 9,648,740
- Application Number:
- 14/502,745
- OSTI ID:
- 1356181
- Resource Relation:
- Patent File Date: 2014 Sep 30
- Country of Publication:
- United States
- Language:
- English
High-density wiring multilayered substrate
|
patent | October 1989 |
Similar Records
Multilayer capacitor suitable for substrate integration and multimegahertz filtering
Polymer thick-film conductors and dielectrics for membrane switches and flexible circuitry