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Title: Formation mechanism for the nanoscale amorphous interface in pulse-welded Al/Fe bimetallic systems

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4947465· OSTI ID:1327114
 [1];  [2];  [2];  [3];  [3]
  1. The Univ. of Hawaii at Manoa, Honolulu, HI (United States)
  2. Zhejiang Univ., Hangzhou (China)
  3. Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

Pulse or impact welding traditionally has been referred to as “solid-state” welding. By integrating advanced interface characterizations and diffusion calculations, we report that the nanoscale amorphous interface in the pulse-welded Al/Fe bimetallic system is formed by rapid heating and melting of a thin Al layer at the interface, diffusion of iron atoms in the liquid aluminum, and subsequent rapid quenching with diffused iron atoms in solution. Here, this finding challenges the commonly held belief regarding the solid-state nature of the impact-based welding process for dissimilar metals. Elongated ultra-fine grains with high dislocation density and ultra-fine equiaxed grains also are observed in the weld interface vicinity on the steel and aluminum sides, respectively, which further confirms that melting and the resulted recrystallization occurred on the aluminum side of the interface.

Research Organization:
Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
AC05-76RL01830
OSTI ID:
1327114
Alternate ID(s):
OSTI ID: 1253929
Report Number(s):
PNNL-SA-118220; APPLAB
Journal Information:
Applied Physics Letters, Vol. 108, Issue 20; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 22 works
Citation information provided by
Web of Science

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Cited By (4)

A State-of-the-Art Review on Solid-State Metal Joining journal January 2019
Thermal Effects in Dissimilar Magnetic Pulse Welding journal March 2019
A State-of-the-Art Review on Solid-State Metal Joining
  • Cai, Wayne; Daehn, Glenn; Vivek, Anupam
  • ASME 2018 13th International Manufacturing Science and Engineering Conference, Volume 2: Materials; Joint MSEC-NAMRC-Manufacturing USA https://doi.org/10.1115/msec2018-6683
conference September 2018
Investigation of Interfacial Layer for Ultrasonic Spot Welded Aluminum to Copper Joints journal October 2017

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