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Title: Encapsulation for Structural Survivability of Electronic Components.

Conference ·
OSTI ID:1123269

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1123269
Report Number(s):
SAND2010-4586C; 492022
Resource Relation:
Conference: Proposed for presentation at the Engineering Sciences External Review Panel held July 19-21, 2010 in Albuquerque, NM.
Country of Publication:
United States
Language:
English