The influence of vortex pinning and grain boundary structure on critical currents across grain boundaries in YBa{sub 2}Cu{sub 3}O{sub x}.
We have used studies of single grain boundaries in YBCO thin films and bulk bicrystals to study the influence of vortex pinning along a grain boundary on dissipation. The critical current density for transport across grain boundaries in thin films is typically more than an order of magnitude larger than that measured for transport across grain boundaries in bulk samples. For low disorientation angles, the difference in critical current density within the grains that form the boundary can contribute to the substantial differences in current density measured across the boundary. However, substantial differences exist in the critical current density across boundaries in thin film compared to bulk bicrystals even in the higher angle regime in which grain boundary dissipation dominates. The differences in critical current density in this regime can be understood on the basis of vortex pinning along the boundary.
- Research Organization:
- Argonne National Lab., IL (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 11067
- Report Number(s):
- ANL/MSD/CP-97512; TRN: US0104254
- Resource Relation:
- Conference: 1998 Applied Superconductivity Conference, Palm Desert, CA (US), 09/13/1998--09/18/1998; Other Information: PBD: 27 Oct 1998
- Country of Publication:
- United States
- Language:
- English
Similar Records
Electrical transport across grain boundaries in bicrystals of YBa sub 2 Cu sub 3 O sub 7. delta
From meandering to straight grain boundaries: Improving the structures of artificially induced grain boundaries in superconducting YBa{sub 2}Cu{sub 3}O{sub y} bicrystals