skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Geometric Summary of the 9 Chip Ladder for the D0 Silicon Tracker

Technical Report ·
DOI:https://doi.org/10.2172/1032128· OSTI ID:1032128

Two hybrids types are required to accomodate the flipping of ladders within each bulkhead layer, in order to account for the pigtail routing. Left and right versions are shown below, following the definitions laid out by Mike Matulik. These drawings are not to proper scale in the sketches below. The dimensionally correct versions of the 9 chip hybrids are stored in DCS under drawing number 3823.112-MD-317803 for the lefthanded version, and 3823.112-MD-317804 for the right handed version. Handedness of the hybrids are designated as shown in the figures and table below. There are long and short versions of both the left and the right, for four total 9 chip hdi designs. The pigtail lengths of the long and short are shown in a table in the hybrid drawings which reside in DCS. The chamfer in the hybrid corners (N side) is placed in order to enable the hybrid to be glued to the beryllium substrate, whereas the rectangular cuttout on the same side is to allow direct gluing of a temperature sensor to the substrate metal. The oblong shape on the N side of both hybrids is a 'stay-clear' region (defined in the final drawings) where pressure will be applied to the hybrid during the second stage of ladder construction.

Research Organization:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC)
DOE Contract Number:
AC02-07CH11359
OSTI ID:
1032128
Report Number(s):
FERMILAB-D0-EN-468; TRN: US1200493
Country of Publication:
United States
Language:
English

Similar Records

D0 Silicon Upgrade: Ladder Assembly Sequences
Technical Report · Wed Aug 17 00:00:00 EDT 1994 · OSTI ID:1032128

D0 Silicon Upgrade: Heat Transfer and Thermal Bowing Calculations of the D0 F-Diskl
Technical Report · Mon Aug 26 00:00:00 EDT 1996 · OSTI ID:1032128

D0 Silicon Upgrade: Thermally Induced Bowing in a 3-CHIP Ladder
Technical Report · Mon Aug 22 00:00:00 EDT 1994 · OSTI ID:1032128