High adherence copper plating process
Patent Application
·
OSTI ID:10165895
A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.
- Research Organization:
- Los Alamos National Lab., NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-36
- Assignee:
- Dept. of Energy
- Patent Number(s):
- PATENTS-US-A7881025
- Application Number:
- ON: DE94014900; PAN: 7-881,025
- OSTI ID:
- 10165895
- Resource Relation:
- Other Information: PBD: 1992
- Country of Publication:
- United States
- Language:
- English
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