Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders
- Univ. of California, Berkeley, CA (United States)
This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 10125229
- Report Number(s):
- LBL-34991; ON: DE94007033
- Resource Relation:
- Other Information: TH: Thesis (M.S.); PBD: Nov 1993
- Country of Publication:
- United States
- Language:
- English
Similar Records
Improving fatigue life in near-eutectic Sn Pb solders
Microstructural observations of the Sn-Pb solder/Cu system and thermal fatigue of the solder joint