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Title: Interfacial and near interfacial crack growth phenomena in metal bonded alumina

Metal/ceramic interfaces can be found in many engineering applications including microelectronic packaging, multi-layered films, coatings, joints, and composite materials. In order to design reliable engineering systems that contain metal/ceramic interfaces, a comprehensive understanding of interfacial and near interfacial failure mechanisms is necessary.
Authors:
 [1]
  1. Univ. of California, Berkeley, CA (United States)
Publication Date:
OSTI Identifier:
795975
Report Number(s):
LBNL--49777
R&D Project: 511906; TRN: US200212%%320
DOE Contract Number:
AC03-76SF00098
Resource Type:
Thesis/Dissertation
Resource Relation:
Other Information: TH: Thesis (Ph.D.); Submitted to the University of California, Berkeley, Berkeley, CA (US); PBD: 1 Mar 2002
Research Org:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org:
USDOE Office of Science (SC)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COATINGS; COMPOSITE MATERIALS; CRACK PROPAGATION; DESIGN; MICROELECTRONICS; PACKAGING