Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]
Patent
·
OSTI ID:5102437
Primary diamines are prepared for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and preimpregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses a room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Dept. of Energy
- OSTI ID:
- 5102437
- Country of Publication:
- United States
- Language:
- English
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· SAMPE Q.; (United States)
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OSTI ID:5102437
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