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U.S. Department of Energy
Office of Scientific and Technical Information

Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

Patent ·
OSTI ID:863812

Primary diamines of the formula ##STR1## wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzo methane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA
DOE Contract Number:
W-7405-ENG-48
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
4,252,936
OSTI ID:
863812
Country of Publication:
United States
Language:
English