Fabrication and characterization of n-type aluminum-boron co-doped ZnO on p-type silicon (n-AZB/p-Si) heterojunction diodes
- Department of Physics, University of the Free State, Bloemfontein ZA-9300 (South Africa)
- Department of Electronic Science, University of Delhi South Campus, New Delhi 110 021 (India)
Graphical abstract: - Highlights: • n-AZB/p-Si heterojunction diodes were formed. • n-AZB/p-Si diode annealed at 700 °C showed best rectifying behavior. • Zn{sub 2}SiO{sub 4} was formed at 800 °C. • n and ϕ{sub b} were estimated to be 1.63 and 0.4 eV, respectively, at 700 °C. • Tailoring of BG was attributed to annealing induced stresses in the films. - Abstract: In this paper, the growth of n-type aluminum boron co-doped ZnO (n-AZB) on a p-type silicon (p-Si) substrate by sol–gel method using spin coating technique is reported. The n-AZB/p-Si heterojunctions were annealed at different temperatures ranging from 400 to 800 °C. The crystallite size of the AZB nanostructures was found to vary from 28 to 38 nm with the variation in annealing temperature. The band gap of the AZB decreased from 3.29 to 3.27 eV, with increasing annealing temperature from 400 to 700 °C and increased to 3.30 eV at 800 °C probably due to the formation of Zn{sub 2}SiO{sub 4} at the interface. The band gap variation is explained in terms of annealing induced stress in the AZB. The n-AZB/p-Si heterojunction exhibited diode behavior. The best rectifying behavior was exhibited at 700 °C.
- OSTI ID:
- 22285194
- Journal Information:
- Materials Research Bulletin, Vol. 48, Issue 11; Other Information: Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 0025-5408
- Country of Publication:
- United States
- Language:
- English
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