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Title: Role of surface temperature in fluorocarbon plasma-surface interactions

Journal Article · · Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
DOI:https://doi.org/10.1116/1.4729445· OSTI ID:22098897
; ;  [1]
  1. Department of Electrical Engineering, University of Texas at Dallas, PO Box 830688, Richardson, TX 75083 (United States)

This article examines plasma-surface reaction channels and the effect of surface temperature on the magnitude of those channels. Neutral species CF{sub 4}, C{sub 2}F{sub 6}, and C{sub 3}F{sub 8} are produced on surfaces. The magnitude of the production channel increases with surface temperature for all species, but favors higher mass species as the temperature is elevated. Additionally, the production rate of CF{sub 2} increases by a factor of 5 as the surface temperature is raised from 25 Degree-Sign C to 200 Degree-Sign C. Fluorine density, on the other hand, does not change as a function of either surface temperature or position outside of the plasma glow. This indicates that fluorine addition in the gas-phase is not a dominant reaction. Heating reactors can result in higher densities of depositing radical species, resulting in increased deposition rates on cooled substrates. Finally, the sticking probability of the depositing free radical species does not change as a function of surface temperature. Instead, the surface temperature acts together with an etchant species (possibly fluorine) to elevate desorption rates on that surface at temperatures lower than those required for unassisted thermal desorption.

OSTI ID:
22098897
Journal Information:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Vol. 30, Issue 4; Other Information: (c) 2012 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 0734-2101
Country of Publication:
United States
Language:
English

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