Theory for Electromigration Failure in Cu Conductors
Journal Article
·
· AIP Conference Proceedings
- IBM T.J. Watson Research Center, Yorktown Heights NY 10598 (United States)
A model for electromigration failure is proposed where the criterion for damage is not classical nucleation forming a void, but is a delamination at an interface. In addition, the anisotropy in the elastic constants of Cu metal is responsible for a bimodal failure distribution recognizing that the driving force for mass transport depends on the hydrostatic stress whereas the failure criterion depends on a normal stress. The agreement with published data is reasonably good.
- OSTI ID:
- 20798183
- Journal Information:
- AIP Conference Proceedings, Vol. 817, Issue 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173528; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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