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Title: Apparatus for the compact cooling of modules

An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
Authors:
;
Publication Date:
OSTI Identifier:
1190908
Report Number(s):
9,076,753
13/475,348
DOE Contract Number:
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 May 18
Research Org:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 97 MATHEMATICS AND COMPUTING