Apparatus for the compact cooling of modules
An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
- Research Organization:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0002894
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Number(s):
- 9,076,753
- Application Number:
- 13/475,348
- OSTI ID:
- 1190908
- Resource Relation:
- Patent File Date: 2012 May 18
- Country of Publication:
- United States
- Language:
- English
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