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Title: Effect of annealing treatment on the dry sliding wear behavior of copper

Abstract

We report the effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as-received and annealed samples under 0.1-10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 μm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.

Authors:
 [1];  [2]
  1. University of South Florida, Tampa, FL (United States); Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
  2. University of Illinois at Urbana-Champaign, IL (United States)
Publication Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States); Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division; National Science Foundation (NSF)
OSTI Identifier:
1607436
Grant/Contract Number:  
FG02-07ER46471; FG02-07ER46453; DMR-1455108
Resource Type:
Accepted Manuscript
Journal Name:
Wear
Additional Journal Information:
Journal Volume: 426-427; Journal Issue: PB; Journal ID: ISSN 0043-1648
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; copper; sliding wear; EBSD; Dynamic recrystallization

Citation Formats

Cai, Wenjun, and Bellon, Pascal. Effect of annealing treatment on the dry sliding wear behavior of copper. United States: N. p., 2019. Web. doi:10.1016/j.wear.2019.01.014.
Cai, Wenjun, & Bellon, Pascal. Effect of annealing treatment on the dry sliding wear behavior of copper. United States. https://doi.org/10.1016/j.wear.2019.01.014
Cai, Wenjun, and Bellon, Pascal. Wed . "Effect of annealing treatment on the dry sliding wear behavior of copper". United States. https://doi.org/10.1016/j.wear.2019.01.014. https://www.osti.gov/servlets/purl/1607436.
@article{osti_1607436,
title = {Effect of annealing treatment on the dry sliding wear behavior of copper},
author = {Cai, Wenjun and Bellon, Pascal},
abstractNote = {We report the effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as-received and annealed samples under 0.1-10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 μm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.},
doi = {10.1016/j.wear.2019.01.014},
journal = {Wear},
number = PB,
volume = 426-427,
place = {United States},
year = {Wed Apr 10 00:00:00 EDT 2019},
month = {Wed Apr 10 00:00:00 EDT 2019}
}

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Works referencing / citing this record:

Wear studies of copper-fly ash composite under dry sliding conditions
journal, September 2019

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