Effect of annealing treatment on the dry sliding wear behavior of copper
Abstract
We report the effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as-received and annealed samples under 0.1-10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 μm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.
- Authors:
-
- University of South Florida, Tampa, FL (United States); Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
- University of Illinois at Urbana-Champaign, IL (United States)
- Publication Date:
- Research Org.:
- Univ. of Illinois at Urbana-Champaign, IL (United States); Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division; National Science Foundation (NSF)
- OSTI Identifier:
- 1607436
- Grant/Contract Number:
- FG02-07ER46471; FG02-07ER46453; DMR-1455108
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Wear
- Additional Journal Information:
- Journal Volume: 426-427; Journal Issue: PB; Journal ID: ISSN 0043-1648
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; copper; sliding wear; EBSD; Dynamic recrystallization
Citation Formats
Cai, Wenjun, and Bellon, Pascal. Effect of annealing treatment on the dry sliding wear behavior of copper. United States: N. p., 2019.
Web. doi:10.1016/j.wear.2019.01.014.
Cai, Wenjun, & Bellon, Pascal. Effect of annealing treatment on the dry sliding wear behavior of copper. United States. https://doi.org/10.1016/j.wear.2019.01.014
Cai, Wenjun, and Bellon, Pascal. Wed .
"Effect of annealing treatment on the dry sliding wear behavior of copper". United States. https://doi.org/10.1016/j.wear.2019.01.014. https://www.osti.gov/servlets/purl/1607436.
@article{osti_1607436,
title = {Effect of annealing treatment on the dry sliding wear behavior of copper},
author = {Cai, Wenjun and Bellon, Pascal},
abstractNote = {We report the effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as-received and annealed samples under 0.1-10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 μm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.},
doi = {10.1016/j.wear.2019.01.014},
journal = {Wear},
number = PB,
volume = 426-427,
place = {United States},
year = {Wed Apr 10 00:00:00 EDT 2019},
month = {Wed Apr 10 00:00:00 EDT 2019}
}
Works referenced in this record:
Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures
journal, August 2005
- Zhang, Kai; Weertman, J. R.; Eastman, J. A.
- Applied Physics Letters, Vol. 87, Issue 6
Hall–Petch breakdown manifested in abrasive wear resistance of nanocrystalline nickel
journal, May 2002
- Schuh, C. A.; Nieh, T. G.; Yamasaki, T.
- Scripta Materialia, Vol. 46, Issue 10
Contact and Rubbing of Flat Surfaces
journal, August 1953
- Archard, J. F.
- Journal of Applied Physics, Vol. 24, Issue 8
Crystallographic textures and texture transitions induced by sliding wear in bronze and nickel
journal, June 2009
- Cai, W.; Mabon, J.; Bellon, P.
- Wear, Vol. 267, Issue 1-4
Abrasive wear response of nanocrystalline Ni–W alloys across the Hall–Petchbreakdown
journal, February 2013
- Rupert, Timothy J.; Cai, Wenjun; Schuh, Christopher A.
- Wear, Vol. 298-299
Sliding wear of nanocrystalline Ni–W: Structural evolution and the apparent breakdown of Archard scaling
journal, July 2010
- Rupert, Timothy J.; Schuh, Christopher A.
- Acta Materialia, Vol. 58, Issue 12
The effects of sliding velocity and sliding time on nanocrystalline tribolayer development and properties in copper
journal, June 2009
- Emge, A.; Karthikeyan, S.; Rigney, D. A.
- Wear, Vol. 267, Issue 1-4
Dry sliding of Cu–15wt%Ni–8wt%Sn bronze: Wear behaviour and microstructures
journal, September 2007
- Singh, J. B.; Cai, W.; Bellon, P.
- Wear, Vol. 263, Issue 1-6
Friction and wear behaviors of nanocrystalline surface layer of pure copper
journal, May 2006
- Zhang, Y. S.; Han, Z.; Wang, K.
- Wear, Vol. 260, Issue 9-10
Overview no. 55 Wear-Mechanism maps
journal, January 1987
- Lim, S. C.; Ashby, M. F.
- Acta Metallurgica, Vol. 35, Issue 1
Characteristics of metallic subsurface zones in sliding and impact wear
journal, December 1981
- Rice, Stephen L.; Nowotny, Hans; Wayne, Steven F.
- Wear, Vol. 74, Issue 1
Stored energy and recrystallization temperature in high purity copper after equal channel angular pressing
journal, December 2008
- Zhang, Yue; Wang, Jing Tao; Cheng, Chang
- Journal of Materials Science, Vol. 43, Issue 23-24
Structural evolution in copper layers during sliding under different lubricant conditions
journal, August 2010
- Moshkovich, Alexey; Perfilyev, Vladislav; Bendikov, Tatyana
- Acta Materialia, Vol. 58, Issue 14
The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper
journal, November 2004
- Zhang, Kai; Weertman, J. R.; Eastman, J. A.
- Applied Physics Letters, Vol. 85, Issue 22
Wear Resistance of Cu/Ag Multilayers: A Microscopic Study
journal, March 2018
- R., Madhavan; Bellon, P.; Averback, R. S.
- ACS Applied Materials & Interfaces, Vol. 10, Issue 17
Fretting wear behavior of nanocrystalline surface layer of copper under dry condition
journal, July 2008
- Zhang, Y. S.; Han, Z.; Lu, K.
- Wear, Vol. 265, Issue 3-4
Stored energy, vacancies and thermal stability of ultra-fine grained copper
journal, September 2008
- Cao, W. Q.; Gu, C. F.; Pereloma, E. V.
- Materials Science and Engineering: A, Vol. 492, Issue 1-2
Grain coarsening behavior in a nanocrystalline copper subjected to sliding friction
journal, May 2014
- Zhang, Y. S.; Niu, H. Z.; Zhang, L. C.
- Materials Letters, Vol. 123
Direct observation of tribological recrystallization
journal, March 2010
- Liao, Y.; EswaraMoorthy, S. K.; Marks, L. D.
- Philosophical Magazine Letters, Vol. 90, Issue 3
Hall-Petch strengthening in nanocrystalline metals
journal, July 1993
- Weertman, J. R.
- Materials Science and Engineering: A, Vol. 166, Issue 1-2
Mechanical Grain Growth in Nanocrystalline Copper
journal, June 2006
- Li, James C. M.
- Physical Review Letters, Vol. 96, Issue 21
Comparisons of dry sliding tribological behaviors between coarse-grained and nanocrystalline copper
journal, January 2012
- Li, W. L.; Tao, N. R.; Han, Z.
- Wear, Vol. 274-275
Effect of grain size on friction and wear of nanocrystalline aluminum
journal, February 1996
- Farhat, Z. N.; Ding, Y.; Northwood, D. O.
- Materials Science and Engineering: A, Vol. 206, Issue 2
Mechanical behavior of nanocrystalline metals and alloys11The Golden Jubilee Issue—Selected topics in Materials Science and Engineering: Past, Present and Future, edited by S. Suresh
journal, November 2003
- Kumar, K. S.; Van Swygenhoven, H.; Suresh, S.
- Acta Materialia, Vol. 51, Issue 19
Surface Softening in Metal–Ceramic Sliding Contacts: An Experimental and Numerical Investigation
journal, January 2015
- Stoyanov, Pantcho; Merz, Rolf; Romero, Pedro A.
- ACS Nano, Vol. 9, Issue 2
Works referencing / citing this record:
Wear studies of copper-fly ash composite under dry sliding conditions
journal, September 2019
- Balamurugan, P.; Uthayakumar, M.; Niemczewska-Wójcik, Magdalena
- Materials Research Express, Vol. 6, Issue 10