Effect of nitrogen passivation on interface composition and physical stress in SiO2/SiC(4H) structures
Abstract
Here, the electron density and physical stress at the thermally oxidized SiC/SiO2 interface, and their change with nitrogen incorporation, were observed using x-ray reflectivity, Raman scattering, and a novel stress determination technique. There is no evidence for residual carbon species at the SiO2/SiC. Instead, a ~1 nm thick low electron density layer is formed at this interface, consistent with interfacial suboxides (SiOx, 0.3 < x < 2), along with high interfacial stress. Nitrogen passivation, a known process to improve the interface state density and electronic properties, eliminates the low density component and simultaneously releases the interface stress. On the basis of these findings, a new chemical interaction model is proposed to explain the effect of the nitrogen, and a guideline, stress managing together with elemental control of the dielectric/SiC interface, is suggested to achieve high quality gate stack on SiC.
- Authors:
-
- Shanghai Jiao Tong Univ., Shanghai (People'e Republic of China); Rutgers Univ., Piscataway, NJ (United States)
- Argonne National Lab. (ANL), Lemont, IL (United States)
- Rutgers Univ., Piscataway, NJ (United States)
- Publication Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES). Chemical Sciences, Geosciences, and Biosciences Division
- OSTI Identifier:
- 1481859
- Grant/Contract Number:
- AC02-06CH11357
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Applied Physics Letters
- Additional Journal Information:
- Journal Volume: 113; Journal Issue: 13; Journal ID: ISSN 0003-6951
- Publisher:
- American Institute of Physics (AIP)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; SiO2; nitrogen passivation; wide band gap device
Citation Formats
Li, Xiuyan, Lee, Sang Soo, Li, Mengjun, Ermakov, Alexei, Medina-Ramos, Jonnathan, Fister, Timothy T., Amarasinghe, Voshadhi, Gustafsson, Torgny, Garfunkel, Eric, Fenter, Paul, and Feldman, Leonard C. Effect of nitrogen passivation on interface composition and physical stress in SiO2/SiC(4H) structures. United States: N. p., 2018.
Web. doi:10.1063/1.5048220.
Li, Xiuyan, Lee, Sang Soo, Li, Mengjun, Ermakov, Alexei, Medina-Ramos, Jonnathan, Fister, Timothy T., Amarasinghe, Voshadhi, Gustafsson, Torgny, Garfunkel, Eric, Fenter, Paul, & Feldman, Leonard C. Effect of nitrogen passivation on interface composition and physical stress in SiO2/SiC(4H) structures. United States. https://doi.org/10.1063/1.5048220
Li, Xiuyan, Lee, Sang Soo, Li, Mengjun, Ermakov, Alexei, Medina-Ramos, Jonnathan, Fister, Timothy T., Amarasinghe, Voshadhi, Gustafsson, Torgny, Garfunkel, Eric, Fenter, Paul, and Feldman, Leonard C. Mon .
"Effect of nitrogen passivation on interface composition and physical stress in SiO2/SiC(4H) structures". United States. https://doi.org/10.1063/1.5048220. https://www.osti.gov/servlets/purl/1481859.
@article{osti_1481859,
title = {Effect of nitrogen passivation on interface composition and physical stress in SiO2/SiC(4H) structures},
author = {Li, Xiuyan and Lee, Sang Soo and Li, Mengjun and Ermakov, Alexei and Medina-Ramos, Jonnathan and Fister, Timothy T. and Amarasinghe, Voshadhi and Gustafsson, Torgny and Garfunkel, Eric and Fenter, Paul and Feldman, Leonard C.},
abstractNote = {Here, the electron density and physical stress at the thermally oxidized SiC/SiO2 interface, and their change with nitrogen incorporation, were observed using x-ray reflectivity, Raman scattering, and a novel stress determination technique. There is no evidence for residual carbon species at the SiO2/SiC. Instead, a ~1 nm thick low electron density layer is formed at this interface, consistent with interfacial suboxides (SiOx, 0.3 < x < 2), along with high interfacial stress. Nitrogen passivation, a known process to improve the interface state density and electronic properties, eliminates the low density component and simultaneously releases the interface stress. On the basis of these findings, a new chemical interaction model is proposed to explain the effect of the nitrogen, and a guideline, stress managing together with elemental control of the dielectric/SiC interface, is suggested to achieve high quality gate stack on SiC.},
doi = {10.1063/1.5048220},
journal = {Applied Physics Letters},
number = 13,
volume = 113,
place = {United States},
year = {Mon Sep 24 00:00:00 EDT 2018},
month = {Mon Sep 24 00:00:00 EDT 2018}
}
Web of Science
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