Platelet composite coatings for tin whisker mitigation

Rohwer, Lauren E. S.; Martin, James E.

doi:10.1007/s11664-015-4026-8

Title: Platelet composite coatings for tin whisker mitigation

Full Record
Other Related Research

Abstract

In this study, reliable methods for tin whisker mitigation are needed for applications that utilize tin-plated commercial components. Tin can grow whiskers that can lead to electrical shorting, possibly causing critical systems to fail catastrophically. The mechanisms of tin whisker growth are unclear and this makes prediction of the lifetimes of critical components uncertain. The development of robust methods for tin whisker mitigation is currently the best approach to eliminating the risk of shorting. Current mitigation methods are based on unfilled polymer coatings that are not impenetrable to tin whiskers. In this paper we report tin whisker mitigation results for several filled polymer coatings. The whisker-penetration resistance of the coatings was evaluated at elevated temperature and high humidity and under temperature cycling conditions. The composite coatings comprised Ni and MgF₂-coated Al/Ni/Al platelets in epoxy resin or silicone rubber. In addition to improved whisker mitigation, these platelet composites have enhanced thermal conductivity and dielectric constant compared with unfilled polymers.

Authors:

Rohwer, Lauren E. S. ^[1]; Martin, James E. ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Publication Date:: Mon Sep 14 00:00:00 EDT 2015

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1236220

Report Number(s):: SAND-2015-8335J
Journal ID: ISSN 0361-5235; 606340

Grant/Contract Number:: AC04-94AL85000

Resource Type:: Accepted Manuscript

Journal Name:: Journal of Electronic Materials

Additional Journal Information:: Journal Volume: 44; Journal Issue: 11; Journal ID: ISSN 0361-5235

Publisher:: Springer

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; polymer-matrix composites; electrical properties; thermal properties; tin whisker mitigation; filled conformal coating

Citation Formats


                    Rohwer, Lauren E. S., and Martin, James E. Platelet composite coatings for tin whisker mitigation.  United States: N. p., 2015. 
Web.  doi:10.1007/s11664-015-4026-8.

Copy to clipboard


                    Rohwer, Lauren E. S., & Martin, James E. Platelet composite coatings for tin whisker mitigation.  United States.  https://doi.org/10.1007/s11664-015-4026-8

Copy to clipboard


                    Rohwer, Lauren E. S., and Martin, James E. Mon .  
"Platelet composite coatings for tin whisker mitigation".  United States.  https://doi.org/10.1007/s11664-015-4026-8.  https://www.osti.gov/servlets/purl/1236220.

Copy to clipboard


                    
@article{osti_1236220,

  title        = {Platelet composite coatings for tin whisker mitigation},

  author       = {Rohwer, Lauren E. S. and Martin, James E.},

  abstractNote = {In this study, reliable methods for tin whisker mitigation are needed for applications that utilize tin-plated commercial components. Tin can grow whiskers that can lead to electrical shorting, possibly causing critical systems to fail catastrophically. The mechanisms of tin whisker growth are unclear and this makes prediction of the lifetimes of critical components uncertain. The development of robust methods for tin whisker mitigation is currently the best approach to eliminating the risk of shorting. Current mitigation methods are based on unfilled polymer coatings that are not impenetrable to tin whiskers. In this paper we report tin whisker mitigation results for several filled polymer coatings. The whisker-penetration resistance of the coatings was evaluated at elevated temperature and high humidity and under temperature cycling conditions. The composite coatings comprised Ni and MgF2-coated Al/Ni/Al platelets in epoxy resin or silicone rubber. In addition to improved whisker mitigation, these platelet composites have enhanced thermal conductivity and dielectric constant compared with unfilled polymers.},

  doi          = {10.1007/s11664-015-4026-8},

  journal      = {Journal of Electronic Materials},

  number       = 11,

  volume       = 44,

  place        = {United States},

  year         = {Mon Sep 14 00:00:00 EDT 2015},

  month        = {Mon Sep 14 00:00:00 EDT 2015}

}

Copy to clipboard

Journal Article:

Free Publicly Available Full Text

Accepted Manuscript (DOE)

Publisher's Version of Record

https://doi.org/10.1007/s11664-015-4026-8

Other availability

Search WorldCat to find libraries that may hold this journal

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE PAGES and OSTI.GOV collections:

Mitigation of tin whisker growth by inserting Ni nanocones

Journal Article Sun, Menglong ; Long, Xiaoping ; Dong, Mengya ; ... - Materials Characterization

Highlights: • Tin whisker growth is mitigated effectively by inserting Ni nanocones. • Ni nanocones impede Sn dynamic recrystallization by blocking dislocation motions. • The inhibition method and mechanism are important to the study of tin whisker. - Abstract: An innovative controllable way has been proposed to mitigate tin whisker growth by inserting Ni nanocones prepared by electrodeposition. The results reveal that, after inserting Ni nanocones, tin whisker formation is mitigated effectively for 1.6 μm Sn coating but there is no inhibition effect for 4.5 μm Sn coating. The coatings are characterized by X-ray diffraction, scanning electron microscopy, energy dispersivemore »« less
https://doi.org/10.1016/J.MATCHAR.2017.11.002
Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation

Journal Article Sivakumar, Preeth ; Du, Surbhi Mahajan ; Selter, Matt ; ... - Polymer Degradation and Stability

Usage of pure tin (Sn) or Sn-rich alloy in electronics industry is growing, which makes them more susceptible to the spontaneous growth of tin whiskers. The risk of having these whiskers can be dramatically mitigated by applying a conformal coating provided that it not only possesses excellent mechanical and adhesion properties but also maintains these properties throughout their service. Parylene C is commonly used as a conformal coating because of its favorable mechanical and physical properties, as well as superior conformal coverage. The purpose of this paper is to investigate the degradation of parylene C coating during the thermal agingmore »« less
https://doi.org/10.1016/j.polymdegradstab.2021.109667

Full Text Available
Tin Whisker Formation - A Stress Relieve Phenomenon

Journal Article Dittes, M ; Oberndorff, P ; Crema, P ; ... - AIP Conference Proceedings

With the move towards lead-free electronics also the solderable finish of electronic components' terminations are converted. While the typical finish was containing 5 % to 20 % lead (Pb) and thus was almost whisker free, lead (Pb)-free finishes such as pure tin or high tin alloys are rather prone to grow whisker. These whiskers are spontaneous protrusions that grow to a significant length of up to millimeters with a typical diameter in the range of few microns and are suspect to cause shorts in electronic assemblies. The latest details of the mechanisms are not yet understood. However it appears tomore »« less
https://doi.org/10.1063/1.2173568
Multifunctional composite coatings for metal whisker mitigation

Patent Rohwer, Lauren E. S. ; Martin, James E.

The present invention relates to composite coatings including particles embedded in a matrix, as well as methods and uses thereof. In some examples, the particles are aligned to enhance mitigation of whisker formation from an underlying metal material. Such coatings can be applied to electrical components, thereby reducing the possibility of electrical short circuits from aberrant whisker growth.
Full Text Available
Oxidation of SiC whisker and platelet reinforced Al{sub 2}O{sub 3} composites and resultant mechanical properties

Conference Leakey, L A ; Loutfy, R O ; Withers, J C

The effect of oxidation of SiC whisker- or platelet-reinforced Al{sub 2}O{sub 3} composites on microstructure and mechanical properties has been investigated. It was found that short-term, high temperature oxidation conditions promote the formation of a low porosity reaction layer which results in significant increases in both strength (up to 23%) and fracture toughness (up to 176%). The extent of improvement was found to be dependent upon the thickness and porosity content of the reaction layer, starting composition, and bulk characteristics of the unoxidized composite.

Similar Records